Impinj Technology Innovations to Enable IoT Functionality for Trillions of Everyday Items
New RAIN RFID endpoint IC series will enable connectivity to everyday items in the retail, grocery, consumer packaged goods, and logistics markets
Seattle, WA March 27, 2019 - Impinj, Inc. (NASDAQ: PI), a leading provider and pioneer of RAIN RFID solutions, today introduced new endpoint IC technologies to meet the increasing demand for item connectivity in the retail, grocery, consumer packaged goods, and logistics markets. Developed in an advanced semiconductor process node, these technologies paint the future of RAIN RFID by endowing Impinj endpoint ICs with differentiated features and enhanced performance, enabling these and other emerging markets in the coming months and years.
Innovations Improve Readability, Add New Features, and Enable Further Developments
Impinj’s pioneering IC technologies improve readability and add new features and functionality to:
- increase the distance, reliability, and speed at which a RAIN RFID system can inventory, locate, and engage items
- enable key RAIN RFID use cases like item authentication, loss prevention, frictionless point-of-sale, and shipment verification
- allow Impinj’s inlay partners to design smaller, high-performing, truly global RAIN RFID tags
“Our endpoint IC technology innovations leverage both Moore’s Law and other leading-edge semiconductor advancements, improving IC performance and increasing functionality now and in the future,” said Impinj CEO Chris Diorio. “We will make smarter tag chips that address key use cases like item authentication, loss prevention, and frictionless point-of-sale. And each new IC we introduce will continue to extend the benefits and capabilities of the Impinj platform.”
New Endpoint IC Series Delivers 2× More Chips Per Silicon Wafer
The new Impinj M700 series of endpoint ICs leverage these innovative IC technologies to enable 300 mm silicon wafers with more than twice as many ICs per wafer as any other RAIN RFID manufacturer’s 300 mm wafers, and more than four times as many as any using 200 mm wafers. Impinj M700 series ICs are so small that roughly 30 million of them will fit in a single coffee cup.
The Impinj M700 series of endpoint ICs enhances the Impinj platform, comprising RAIN RFID endpoints, connectivity, and software. Organizations around the world use the Impinj platform to connect items to applications, enabling the Internet of Things. Impinj endpoint ICs have already enabled connectivity for more than 30 billion everyday items—including retail apparel, airline luggage, manufacturing equipment, and logistics items—allowing businesses to make smarter decisions, improve customer experience, and drive sales.
“The IoT platform we created and the ubiquitous item connectivity we envision form the bedrock of an epic opportunity—to expand the Internet's reach to trillions of everyday items and deliver data and services for those connected items, profoundly enhancing business efficiencies and improving peoples' lives,” said Diorio.
Impinj will demonstrate the first chips in the Impinj M700 series to select partners and customers at RFID Journal Live from April 2-4, 2019.
Impinj (NASDAQ: PI) helps businesses and people analyze, optimize, and innovate by wirelessly connecting billions of everyday things—such as apparel, automobile parts, luggage, and shipments—to the Internet. The Impinj platform uses RAIN RFID to deliver timely data about these everyday things to business and consumer applications, enabling a boundless Internet of Things. www.impinj.com
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